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Self-reducible copper complex inks with aminediol and OH-based solvent for the fabrication of a highly conductive copper film by calcination at low temperature under an air atmosphere

https://hiroshima.repo.nii.ac.jp/records/2007792
https://hiroshima.repo.nii.ac.jp/records/2007792
5b8d8556-c8fe-468e-80d0-b38c4eae2b0a
名前 / ファイル ライセンス アクション
NewJChem_44_19880.pdf NewJChem_44_19880.pdf (1.0 MB)
Item type デフォルトアイテムタイプ_(フル)(1)
公開日 2023-03-18
タイトル
タイトル Self-reducible copper complex inks with aminediol and OH-based solvent for the fabrication of a highly conductive copper film by calcination at low temperature under an air atmosphere
言語 en
作成者 Yabuki, Akihiro

× Yabuki, Akihiro

en Yabuki, Akihiro

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Sakaguchi, Takuhiro

× Sakaguchi, Takuhiro

en Sakaguchi, Takuhiro

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Indra Wahyudhin Fathona

× Indra Wahyudhin Fathona

en Indra Wahyudhin Fathona

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Lee, Ji Ha

× Lee, Ji Ha

en Lee, Ji Ha

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アクセス権
アクセス権 open access
アクセス権URI http://purl.org/coar/access_right/c_abf2
権利情報
権利情報 This is not the published version. Please cite only the published version. この論文は出版社版ではありません。引用の際には出版社版をご確認、ご利用ください。
内容記述
内容記述 A simple fabrication of copper conductive film was accomplished in one step at low temperature under an air atmosphere. The strategy for solving the problem was the use of both aminediol and OH-based solvent for self-reducible copper complex inks. The complex ink consisted of copper formate, aminediol, and various OH-based solvents calcinated at various temperatures, which resulted in a conductive copper film via rapid calcination at low temperature. The ratio of copper formate, aminediol, and OH-based solvent in complex inks was optimized for a higher conductive copper film. The copper film from the complex ink with a ratio of 1 (copper formate) : 2.2 (aminediol) : 1.8 (diol solvent) was rapidly calcined at 180 °C under an air atmosphere and showed approximately 15 μΩ cm, which is approximately 10 times that of bulk copper. The combination of aminediol and OH-based solvent inhibited the oxidation of the copper surface via adsorption. The developed process is applicable to conductive circuits, resistors, and capacitors in the form of oxide films for use as printable electronics fabricated under an air atmosphere.
言語 en
出版者
出版者 Royal Society of Chemistry
言語
言語 eng
資源タイプ
資源タイプ識別子 http://purl.org/coar/resource_type/c_6501
資源タイプ journal article
出版タイプ
出版タイプ AO
出版タイプResource http://purl.org/coar/version/c_b1a7d7d4d402bcce
関連情報
識別子タイプ DOI
関連識別子 10.1039/D0NJ04725B
関連情報
識別子タイプ DOI
関連識別子 https://doi.org/10.1039/D0NJ04725B
収録物識別子
収録物識別子タイプ ISSN
収録物識別子 1144-0546
収録物識別子
収録物識別子タイプ ISSN
収録物識別子 1369-9261
開始ページ
開始ページ 19880
書誌情報 New Journal of Chemistry
New Journal of Chemistry

巻 44, p. 19880-19884, 発行日 2020-10-28
旧ID 51518
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